Strength

? MOSFET Device and Process Technology including UBM / BGBM / WLCSP-Assembly

? Device / Process SimulationCapability (2D/3D simulation)

? Design Capability (Mask CAD, PCB CAD, Mechanical CAD)

? Owned Evaluation Lab in Japan: Component and Circuit Analysis/MeasurementCapability

? Utilizing more than 20 years of device experience and sales network in Asia

Low Voltage Power Mosfet (WLCSP)

? Development of high-performance devices and solution proposal with best-in-class technology

? Propose Power MOSFET solutions in terms of cost, robust quality, performance, and service

? Provide high-performance products with advanced wafer process and package development technology

? Move to middle voltage after low voltage 12/24V launch

優(yōu)勢(shì)

? MOSFET器件和工藝技術(shù)，包括UBM / BGBM / WLCSP-組裝；

? 具備器件/工藝仿真能力（2D/3D仿真）；

? 具備設(shè)計(jì)能力（包含CAD、PCB CAD、機(jī)械CAD）；

? 在日本擁有評(píng)估實(shí)驗(yàn)室：具備元件和電路分析/測(cè)量能力；

? 超過(guò)20年的器件經(jīng)驗(yàn)和亞洲的銷(xiāo)售網(wǎng)絡(luò)。

低壓 Mosfet（WLCSP）

? 以一流的技術(shù)，開(kāi)發(fā)高性能器件，并且同時(shí)能夠提出相應(yīng)的解決方案和建議；

? 在成本、質(zhì)量穩(wěn)定、性能和服務(wù)方面提出功率MOSFET的解決方案；

? 采用先進(jìn)的晶圓制程和封裝技術(shù)，提供高性能產(chǎn)品；

? 在推出低電壓12/24V后轉(zhuǎn)向中電壓。